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manual [2020/11/30 18:28] bgfdsuperadmin |
manual [2020/11/30 19:57] bgfdsuperadmin |
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//Edited by Bluegoldfishdesign 20-Nov-20// | //Edited by Bluegoldfishdesign 20-Nov-20// | ||
- | {{https://www.allaboutcircuits.com/ | + | {{ hc12:hc12pcb.png }} |
=== Product Applications === | === Product Applications === | ||
* Wireless sensor | * Wireless sensor | ||
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* 2014/09 version 2.3 Chinese, www.wavesen.com | * 2014/09 version 2.3 Chinese, www.wavesen.com | ||
* 2016/01 version 2.3B Translated v2.3 online and merged with v1.1 by RR | * 2016/01 version 2.3B Translated v2.3 online and merged with v1.1 by RR | ||
+ | * 2020/11 version 2.3B(BGFD) Edit of v2.3B by Bluegoldfish Design (CJM) | ||
=== Product Features === | === Product Features === | ||
- | * Long-distance wireless transmission (FU3: 1000m in open space, baud rate | + | * Long-distance wireless transmission (FU3: 1000m in open space, baud rate 5000bps in the air. FU4: 1800m in open space, baud rate 500bps in the air) |
- | 5000bps in the air. FU4: 1800m in open space, baud rate 500bps in the air) | + | |
* Working frequency range (433.4-473.0MHz, | * Working frequency range (433.4-473.0MHz, | ||
* Maximum 100mW (20dBm) transmitting power (8 levels of power can be set) | * Maximum 100mW (20dBm) transmitting power (8 levels of power can be set) | ||
* Four working modes, adapted to different application situations | * Four working modes, adapted to different application situations | ||
- | * Built-in MCU performs communication with external device through serial | + | * Built-in MCU performs communication with external device through serial port, no programming or configuration required for basic use |
- | port, no programming or configuration required for basic use | + | * The number of bytes transmitted continuously is unlimited (FU1 and FU3 modes only) |
- | * The number of bytes transmitted continuously is unlimited (FU1 and FU3 | + | |
- | modes only) | + | |
* Update software version through the serial port | * Update software version through the serial port | ||
=== Product Introduction === | === Product Introduction === | ||
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an antenna solder eyelet ANT2 on the module, convenient to solder a spring | an antenna solder eyelet ANT2 on the module, convenient to solder a spring | ||
antenna to. Select one of these antenna options according to usage requirements. | antenna to. Select one of these antenna options according to usage requirements. | ||
+ | |||
The module has an onboard MCU, eliminating the need for user to program the | The module has an onboard MCU, eliminating the need for user to program the | ||
radio section separately, with transparent half-duplex serial transmission | radio section separately, with transparent half-duplex serial transmission | ||
Line 56: | Line 56: | ||
FU4 in idle state are: 3.6mA, 80uA, 16mA, and 16mA respectively, | FU4 in idle state are: 3.6mA, 80uA, 16mA, and 16mA respectively, | ||
maximum working current in any mode is 100mA (in the transmitting state). | maximum working current in any mode is 100mA (in the transmitting state). | ||
- | Product Configuration | + | |
+ | === Product Configuration | ||
Standard configuration of the HC-12 module only contains one 433MHz-frequencyband | Standard configuration of the HC-12 module only contains one 433MHz-frequencyband | ||
wireless communication module with IPEX20279-001E-03 standard RF socket. | wireless communication module with IPEX20279-001E-03 standard RF socket. | ||
Line 63: | Line 64: | ||
with BNC connector base. The user can purchase these according to their | with BNC connector base. The user can purchase these according to their | ||
application requirements. | application requirements. | ||
- | Technical Details | + | |
+ | === Technical Details | ||
The HC-12 module uses a Silicon Labs Si4463 to provide the RF communications | The HC-12 module uses a Silicon Labs Si4463 to provide the RF communications | ||
link. This is a high performance, | link. This is a high performance, | ||
Line 73: | Line 75: | ||
be aware of the RF link. Serial port and transceiver configurations are held in | be aware of the RF link. Serial port and transceiver configurations are held in | ||
onboard non-volatile flash memory. | onboard non-volatile flash memory. | ||
- | Product Dimensions | + | |
- | Definition of Pins | + | === Product Dimensions |
+ | {{ hc12: | ||
+ | === Definition of Pins === | ||
The HC-12 module can be patch soldered, or have a 2.54mm-spacing pin header | The HC-12 module can be patch soldered, or have a 2.54mm-spacing pin header | ||
attached and directly inserted onto the user’s PCB. The module has nine pins in | attached and directly inserted onto the user’s PCB. The module has nine pins in | ||
total, and one RF antenna socket (ANT1), with definitions as shown in the table | total, and one RF antenna socket (ANT1), with definitions as shown in the table | ||
below: | below: | ||
- | Pin Definition I/O direction Notes | + | |
- | 1 Vcc | + | ^ Pin ^ Definition |
- | Power supply input, DC3.2V-5.5V, | + | | 1 | Vcc | | Power supply input, DC3.2V-5.5V, |
- | capacity not less than 200mA. Note: if the | + | | 2 | GND | | Common ground |
- | module is working in the transmitting state | + | | 3 | RxD | Input (weak pullup) |
- | for an extended time, it is suggested that a | + | | 4 | TxD | Output |
- | 1N4007 diode be connected in series if the | + | | 5 | SET | Input (10k pullup) |
- | supply voltage is greater than 4.5V, so as to | + | | 6 | ANT | Input/ |
- | avoid overheating the onboard LDO regulator | + | | 7 | GND | Common ground |
- | 2 GND Common ground | + | | 8 | GND | Common ground |
- | 3 RxD | + | | 9 | NC | |
- | Input | + | | ANT1 | ANT | Input/ |
- | (weak pullup) | + | | ANT2 | ANT | Input/ |
- | UART data input, TTL level. 1k resistor | + | |
- | connected in series inside the module | + | |
- | 4 TxD Output UART data output, TTL level. 1k resistor | + | |
- | connected in series inside the module | + | |
- | 5 SET | + | |
- | Input | + | |
- | (10k pullup) | + | |
- | Parameter setting control pin, active low | + | |
- | level. 1k resistor connected in series inside | + | |
- | the module | + | |
- | 6 ANT Input/ | + | |
- | 7 GND Common ground | + | |
- | 8 GND Common ground | + | |
- | 9 NC | + | |
- | No connection, used in mechanical fixing, | + | |
- | compatible with HC-11 module pin position | + | |
- | ANT1 ANT Input/ | + | |
- | ANT2 ANT Input/ | + | |
Pins 1-6 each have two bonding pads, with the outer half-hole bonding pads | Pins 1-6 each have two bonding pads, with the outer half-hole bonding pads | ||
intended for patch soldering. When the inner bonding pad ANT2 of Pin 6 is used | intended for patch soldering. When the inner bonding pad ANT2 of Pin 6 is used | ||
Line 115: | Line 102: | ||
round-hole bonding pads of Pins 1-5 may then be used to solder a 2.54mm-spacing | round-hole bonding pads of Pins 1-5 may then be used to solder a 2.54mm-spacing | ||
pin header that can be plugged into a PCB socket. | pin header that can be plugged into a PCB socket. | ||
- | Wireless Serial Port Transparent Transmission | + | |
+ | === Wireless Serial Port Transparent Transmission | ||
(1) Simple introduction of working principle | (1) Simple introduction of working principle | ||
+ | |||
As shown in the above diagram, two HC-12 modules can be used in place of | As shown in the above diagram, two HC-12 modules can be used in place of | ||
physical wiring to replace a wired half-duplex serial communications link | physical wiring to replace a wired half-duplex serial communications link |