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manual [2020/11/30 18:28] bgfdsuperadmin |
manual [2020/11/30 18:59] bgfdsuperadmin |
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* 2014/09 version 2.3 Chinese, www.wavesen.com | * 2014/09 version 2.3 Chinese, www.wavesen.com | ||
* 2016/01 version 2.3B Translated v2.3 online and merged with v1.1 by RR | * 2016/01 version 2.3B Translated v2.3 online and merged with v1.1 by RR | ||
+ | * 2020/11 version 2.3B(BGFD) Edit of v2.3B by Bluegoldfish Design (CJM) | ||
=== Product Features === | === Product Features === | ||
- | * Long-distance wireless transmission (FU3: 1000m in open space, baud rate | + | * Long-distance wireless transmission (FU3: 1000m in open space, baud rate 5000bps in the air. FU4: 1800m in open space, baud rate 500bps in the air) |
- | 5000bps in the air. FU4: 1800m in open space, baud rate 500bps in the air) | + | |
* Working frequency range (433.4-473.0MHz, | * Working frequency range (433.4-473.0MHz, | ||
* Maximum 100mW (20dBm) transmitting power (8 levels of power can be set) | * Maximum 100mW (20dBm) transmitting power (8 levels of power can be set) | ||
* Four working modes, adapted to different application situations | * Four working modes, adapted to different application situations | ||
- | * Built-in MCU performs communication with external device through serial | + | * Built-in MCU performs communication with external device through serial port, no programming or configuration required for basic use |
- | port, no programming or configuration required for basic use | + | * The number of bytes transmitted continuously is unlimited (FU1 and FU3 modes only) |
- | * The number of bytes transmitted continuously is unlimited (FU1 and FU3 | + | |
- | modes only) | + | |
* Update software version through the serial port | * Update software version through the serial port | ||
=== Product Introduction === | === Product Introduction === | ||
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an antenna solder eyelet ANT2 on the module, convenient to solder a spring | an antenna solder eyelet ANT2 on the module, convenient to solder a spring | ||
antenna to. Select one of these antenna options according to usage requirements. | antenna to. Select one of these antenna options according to usage requirements. | ||
+ | |||
The module has an onboard MCU, eliminating the need for user to program the | The module has an onboard MCU, eliminating the need for user to program the | ||
radio section separately, with transparent half-duplex serial transmission | radio section separately, with transparent half-duplex serial transmission | ||
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FU4 in idle state are: 3.6mA, 80uA, 16mA, and 16mA respectively, | FU4 in idle state are: 3.6mA, 80uA, 16mA, and 16mA respectively, | ||
maximum working current in any mode is 100mA (in the transmitting state). | maximum working current in any mode is 100mA (in the transmitting state). | ||
- | Product Configuration | + | |
+ | === Product Configuration | ||
Standard configuration of the HC-12 module only contains one 433MHz-frequencyband | Standard configuration of the HC-12 module only contains one 433MHz-frequencyband | ||
wireless communication module with IPEX20279-001E-03 standard RF socket. | wireless communication module with IPEX20279-001E-03 standard RF socket. | ||
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with BNC connector base. The user can purchase these according to their | with BNC connector base. The user can purchase these according to their | ||
application requirements. | application requirements. | ||
- | Technical Details | + | |
+ | === Technical Details | ||
The HC-12 module uses a Silicon Labs Si4463 to provide the RF communications | The HC-12 module uses a Silicon Labs Si4463 to provide the RF communications | ||
link. This is a high performance, | link. This is a high performance, | ||
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be aware of the RF link. Serial port and transceiver configurations are held in | be aware of the RF link. Serial port and transceiver configurations are held in | ||
onboard non-volatile flash memory. | onboard non-volatile flash memory. | ||
- | Product Dimensions | + | |
+ | === Product Dimensions | ||
Definition of Pins | Definition of Pins | ||
The HC-12 module can be patch soldered, or have a 2.54mm-spacing pin header | The HC-12 module can be patch soldered, or have a 2.54mm-spacing pin header |